Computer Science
Conference Title | 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025) |
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Conference Dates | Apr 25-27 , 2025 |
Submission Deadline | 2025-04-16 |
Indexes | EI-compendex , SCOPUS , inspect |
Official Web Site | https://www.aemcse.org |
Venue | Nanjing, China |
Location | Nanjing , China |
Description | 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering(AEMCSE 2025) IMPORTANT INFORMATION Conference Dates: April 25-27, 2025 Conference Venus: Nanjing, China Conference Website: https://www.aemcse.org Sponsored by: Nanjing University of Information Science and Technology, China Publication: IEEE Xplore, EI Compendex and Scopus for indexing INTRODUCTION The 2025 8th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2025) will be grandly held in Nanjing, China, from April 25-27, 2025. This conference aims to provide a platform for scholars, researchers, and industry professionals worldwide to exchange the latest research findings and explore development trends. The conference will cover various fields, including but not limited to the design and application of advanced electronic materials, new developments in computer science, best practices in software engineering, innovative applications of artificial intelligence technologies, and information security. Renowned international experts will be invited to deliver keynote speeches, and multiple parallel sessions will be organized to facilitate in-depth discussions and collaborations among participants. AEMCSE 2025 offers valuable opportunities for participants to share research results, discuss technological challenges, and establish cooperative relationships. We sincerely invite experts and scholars from related fields to visit Nanjing and jointly promote the progress and innovation in electronic materials, computer science, and software engineering. COMMITTEE Conference General Chairs Prof. Yonghui Li, The University of Sydney, Australia (IEEE Fellow, ARC Future Fellow) Prof. Lei Zhang, Nanjing University of Information Science and Technology, China Technical Program Committee Chairs Prof. Benjamin W. Wah, Chinese University of Hong Kong, Hong Kong, China (AAAS/ACM/IEEE Fellow) Prof. Witold Pedrycz, University of Alberta, Canada (IEEE Fellow) Prof. Chuanyou Ju, Nanjing University of Information Science and Technology, China Prof. Wenjun Tan, Northeastern University, China Organizing Committee Chairs Prof. Dongsheng Geng, Nanjing University of Information Science and Technology, China Prof. Guozhen Zhang, Nanjing University of Information Science and Technology, China Publication Chairs Prof. Shaofeng Shao, Nanjing University of Information Science and Technology, China Prof. Song Wei, Nanjing University of Information Science and Technology, China PUBLICATION All papers, both invited and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted full papers will be published by IEEE (ISBN:979-8-3315-1091-6) and submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore's scope and quality requirements, and also submitted to EI Compendex and Scopus for indexing. CALL FOR PAPER Computers Engineering · High Performance Computing and Optimization · Computer system and architecture design · Cybersecurity and Privacy Protection · Artificial Intelligence and Machine Learning System · Quantum Computer and Applications · Embedded System and Internet of Things · Data Center Technology · Computer Vision and Graphics · Algorithm Design and Complexity · Signal processing · Communication and wireless networks · Optical communication · Information Security Software Engineering · Software Testing and Quality Assurance · Continuous Integration and Continuous Deployment · Software Architecture and Design Patterns · Cloud Computing and Service-oriented Architecture · Mobile Application Development and Platform · User interface Design and User Experience · Software Project Management and Agile Development · DevOps Culture and Automation Tools · Software design method · Software testing technology · Component-based software engineering Advanced Electronic Materials · Nanomaterials and Nanotechnology · Semiconductor Materials and Devices · Electronic Packaging and Interconnection Technology · Flexible electronics and smart wearable devices · High Frequency Electronic Materials and Applications · Electronic ceramics and catalytic materials · Photoelectric materials and LED technology · Thermoelectric materials and thermal management · technologyBattery Technology and Energy Storage SUBMISSION You can submit your paper (word+pdf) via Electronic Submission System Submission System (English) (Pay for USD) Link: https://paper-sub.com/paper/AEUNV2 Submission System (Chinese) (Pay for RMB)Link: https://www.ais.cn/attendees/paperSubmit/AEUNV2 Paper Template: https://www.aemcse.org/download Article acceptance requirements The criteria for an article to be accepted for publication include: 1. The article should be original writing that enhances the existing body of knowledge in the given subject area. Original review articles and surveys are acceptable, even if new data/concepts are not presented. 2. Results reported have not been submitted or published elsewhere . 3. Experiments, statistics, and other analyses are performed to a high technical standard and are described in sufficient detail. 4. Conclusions are presented in an appropriate fashion and are supported by the data. 5. The article is presented in an intelligible fashion and is written in Standard English. 6. Appropriate references to related prior published works must be included. 7.All submissions must not be less than 4 pages in length. CONTACT Conference Secretary: E-Mail: AEMCSE@163.com Ms. Kwok Tel: +86-18124944750 (WeChat) |
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