|Conference Title||2023 6th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2023)|
|Conference Dates||Apr 21-23 , 2023|
|Indexes||EI-compendex , SCOPUS|
|Official Web Site||http://aemcse.org|
|Location||Shenyang , China|
|Description||2023 6th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2023)
Full Paper Submission Date: February 15, 2023
Registration Deadline: March 1, 2023
Conference Date: April 21-23, 2023
Conference Venue:Dalian, Liaoning, China
Official website: http://aemcse.org
Official Email: AEMCSE@163.com
【Welcome to AEMCSE 2023】
The 2023 6th International Conference on Advanced Electronic Materials, Computers and Software Engineering (AEMCSE 2023) will be held in Dalian, China on April 21-23, 2023.
AEMCSE is proud to host a global gathering of theorists and experts in Advanced Electronic Materials, Computers and Software Engineering in the highly complex field of knowledge and software engineering, which brings researchers, practitioners, and scientists in discussion of the latest methods, research developments, and future opportunities. This event will include the participation of renowned keynote speakers, oral presentations, posters sessions and so on.
If you do not need to publish any paper, you may attend our conference as oral/poster presenter, or listener. AEMCSE 2023 welcomes submission of researches concerning any branch of Advanced Electronic Materials, Computers and Software Engineering.
Conference General Chair
Prof. Defu Zhang, Xiamen University, China
Technical Program Committee Chair
Prof.Guandong Xu, University of Technology Sydney, Australia
Prof.Guandong Xu, University of Technology Sydney, Australia (IET FELLOW、ACS fellow)
【Call for paper】
Topics include but are not limited to the following areas:
▪Digital Signal Processing (DSP)
▪Advanced Adaptive Signal Processing
▪Computer Vision & VR
▪Multimedia & Human-computer Interaction
▪AI & Neural Networks
▪Communication Signal processing
▪Programming language and software engineering
▪Information and communication security
▪Artificial intelligence and recognition
▪Embedded software and applications
▪Cloud computing technology
▪Big data analysis and processing
▪Piezoelectric and ferroelectric materials
▪Conductive metals and their alloys
▪Electromagnetic shielding materials
* Other related topics..
Accepted and registered full papers of AEMCSE 2023 will be published by conference proceedings, which will be submitted to EI Compendex, Scopus for indexing. Authors are required to attend the conference and share a report based on the paper.
>>>If you request paper publication. Please submit your full paper(word+pdf) before the submission deadline.
1.Please follow the Manuscript template to write.
2.All submissions must not be less than 4 pages and not exceed 10 pages in length.
3.The article should be original writing that enhances the existing body of knowledge in the given subject area.
4.Results reported have not been submitted or published elsewhere .
5. Experiments, statistics, and other analyses are performed to a high technical standard and are described in sufficient detail.
6.Conclusions are presented in an appropriate fashion and are supported by the data.
7.The article is presented in an intelligible fashion and is written in Standard English.
8. Appropriate references to related prior published works must be included.
* For Presenter and Participant who are interested in attending AEMCSE 2023 with no publication, please complete the registration on the Online Registration System[https://www.ais.cn/attendees/toSignUp/7BARAV].
1.Regular Registration for Paper (4 Pages)：3400RMB/per paper
2.Student/committee (4 Pages): 3100RMB/per paper
3.Extra Pages (Begin at Page 5): 300RMB/per extra page
4.Presenter Only: 1500RMB
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