IETP-Conference on Open Access
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Electrical and Electronic Engineering

Conference Title 2023 2nd International Conference on Electronics and Integrated Circuit Technology(EICT 2023)
Conference Dates Feb 24-26 , 2023
Submission Deadline 2022-11-16
Indexes EI-compendex , SCOPUS
Official Web Site
Venue Chengdu
Location Chengdu , China
Description ● Welcome to EICT 2023
2023 2nd International Conference on Electronics and Integrated Circuit Technology (EICT 2023)
February 24-26, 2023 | Chengdu, China

The 2nd International Conference on Electronics and Integrated Circuit Technology (EICT 2023) will be held in Chengdu, China from February 24 to 26, 2023.
The conference aims to provide a platform for experts and scholars, engineers and technical researchers engaged in relevant research fields to share scientific research achievements and cutting-edge technologies, understand the trend of academic development, broaden research ideas, and promote industrial cooperation of academic achievements. We warmly invite you to attend this academic conference and look forward to meeting you in Chengdu!

● Publication
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

● Call for Papers
Topics of interest for submission include, but are not limited to:
• Electronic Science and Technology,
• Integrated circuit design and integrated system,
• Electronic Information Engineering,
• Electronic Information Science and Technology,
• Electronic materials and devices
• Digital information processing
• Electronic and optical information technology
• High frequency technology
• Communication network
• Communication engineering
• Microelectronics and Integrated Circuits,
• New energy materials and devices,
• Integration of new sensing technologies and applications,
• Magneto-electronic materials and Applications
• Microelectronics CAD technology
• Materials and photoelectric detection systems
• Semiconductor sensing electronics
• Micro nano sensor
• Etching and packaging of integrated circuits
• Integrated circuit system design automation
• Integrated circuit engineering
• Integrated circuit device materials,
• Integrated circuit design,
• Integrated circuit packaging,
• Integrated circuit manufacturing

● Paper Submission
You can submit your full paper through electronic submission system:

● Notes
1. Manuscripts must be written in English;
2. The manuscript should be written in accordance with the standard of template:
3. The paper should be no less than 5 pages and no longer than 10 pages;
4. Plagiarism is prohibited;
5. Duplicate submission is prohibited;

●Call for participants
1. Presenter : As presenter, you need to submit the abstract and title of your presentation before register. For further information, please contact us at:
2. Listener : You are welcome to attend this great event. You need to complete the registration as Listener before the registration deadline.
3. Reviewer : We sincerely welcome professors, associate professors, teachers and other experts in these areas join the conference as a reviewer. Welcome to send email to for further information.

● Contact Us
Conference Secretary: Ms.Cen
Tel: +86-13432066330 (WeChat)
QQ: 239198338

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